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Leaded varistors
AdvanceD-MP, S14 series
B722*
Test
Solderability
Resistance to soldering
heat
Tensile strength
Test methods/conditions
IEC 60068-2-20, test Ta,
method 1 with modified conditions for
lead-free solder alloys: 245 ° C, 3 s:
After dipping the terminals to a depth of
approximately 3 mm from the body in a
soldering bath of 245 ° C for 3 s, the
terminals shall be visually examined.
IEC 60068-2-20, test Tb, method 1A,
260 ° C, 10 s:
Each lead shall be dipped into a solder
bath having a temperature of 260 ± 5 ° C
to a point 2.0 to 2.5 mm from the body
of the specimen, be held there for
10 ± 1 s and then be stored at room
temperature and normal humidity for
1 to 2 h.
The change of V V shall be measured
and the specimen shall be visually
examined.
IEC 60068-2-21, test Ua1
After gradually applying the force
specified below and keeping the unit
fixed for 10 s, the terminal shall be
visually examined for any damage.
Force for wire diameter:
0.6 mm = 10 N
0.8 mm = 10 N
1.0 mm = 20 N
Requirement
The inspection shall be
carried out under adequate
light with normal eyesight or
with the assistance of a
magnifier capable of giving
a magnification of 4 to
10 times. The dipped
surface shall be covered
with a smooth and bright
solder coating with no more
than small amounts of
scattered imperfections
such as pinholes or
un-wetted or de-wetted
areas. These imperfections
shall not be concentrated in
one area.
| ? V/V (1 mA)| ≤ 5%
No visible damage
| ? V/V (1 mA)| ≤ 5%
No break of solder joint,
no wire break
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 22
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